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Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
Internal details of a two head, gantry style pick-and-place JUKI SMT machine. In the foreground are tape and reel feeders, then the (currently empty) conveyor belt for printed circuit boards, and in back are large parts in a tray. The gantry carries two pickup nozzles, flanking a camera (marked "do not touch" to avoid fingerprints on the lens).
TO-262: [24] Also called I2PAK: SMT package similar to the D2PAK but with longer leads for SMT or TH mounting; TO-263: [24] Also called D2PAK: SMT package similar to the TO-220 without the extended tab and mounting hole; TO-274: [24] Also called Super-247: SMT package similar to the TO-247 without the mounting hole
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Four-PCB panel. Depaneling or depanelization is a process step in high-volume electronics assembly production. In order to increase the throughput of printed circuit board (PCB) manufacturing and surface mount (SMT) lines, PCBs are often arranged in a process called panelization so that they consist of many smaller individual PCBs that will be used in the final product.
Wave soldering is a bulk soldering process used in printed circuit board manufacturing. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board.
SMTC Corporation (Surface Mount Technology Centre), founded in 1985, is a mid-size provider of end-to-end electronics manufacturing services (EMS) including PCBA production, systems integration and comprehensive testing services, enclosure fabrication, as well as product design, sustaining engineering and supply chain management services.
As well as forming the solder joint itself, the paste carrier/flux must have sufficient tackiness to hold the components while the assembly passes through the various manufacturing processes, perhaps moved around the factory. Printing is followed by a complete reflow soldering process.