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Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...
To the right is a smaller heat sink cooling another integrated circuit of the motherboard. Typical heatsink-fan combination found on a consumer laptop. The heatpipes which contain a working fluid make direct contact with the CPU and GPU, conducting heat away from the component and transferring it to the fin-stack mounted on the exhaust port of ...
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
An all-in-one (AIO) cooling unit, installed in a case DIY water cooling setup showing a 12 V pump, CPU waterblock and the typical application of a T-Line Schematic of a regular liquid cooling setup for PCs. Liquid cooling is a highly effective method of removing excess heat, with the most common heat transfer fluid in desktop PCs being ...
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Immersion cooling is a promising thermal management technique to address these challenges. [26] Immersion cooling of batteries is specifically beneficial in abuse conditions, where the thermal propagation is needed to be avoided across the battery module or pack.
Space cooling on one hand, and equipment cooling on the other, cannot be viewed as two isolated parts of the overall thermal challenge. The main purpose of an equipment facility's air-distribution system is to distribute conditioned air in such a way that the electronic equipment is cooled effectively.
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