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Network interface controller, Wi-Fi, and Bluetooth are provided by external chips connected to the chipset through PCIe or USB. All 300 series chipsets are made using 55 nm lithography. [ 43 ] The X570 chipset is a repurposed Matisse/Vermeer IO die made using a 14 nm process.
A PCI Express 2.0 x1 expansion card that provides USB 3.0 connectivity [b] PCI-SIG announced the availability of the PCI Express Base 2.0 specification on 15 January 2007. [61] The PCIe 2.0 standard doubles the transfer rate compared with PCIe 1.0 to 5 GT/s and the per-lane throughput rises from 250 MB/s to 500 MB/s. Consequently, a 16-lane ...