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Polymers represent another large area in which thermal analysis finds strong applications. Thermoplastic polymers are commonly found in everyday packaging and household items, but for the analysis of the raw materials, effects of the many additive used (including stabilisers and colours) and fine-tuning of the moulding or extrusion processing used can be achieved by using differential scanning ...
In soldering, a thermal profile is a complex set of time-temperature values for a variety of process dimensions such as slope, soak, TAL, and peak. [8] Solder paste contains a mix of metal, flux, and solvents that aid in the phase change of the paste from semi-solid, to liquid to vapor; and the metal from solid to liquid.
The simplest form of a group-contribution method is the determination of a component property by summing up the group contributions : [] = +.This simple form assumes that the property (normal boiling point in the example) is strictly linearly dependent on the number of groups, and additionally no interaction between groups and molecules are assumed.
A simple method for determining an overall heat transfer coefficient that is useful to find the heat transfer between simple elements such as walls in buildings or across heat exchangers is shown below. This method only accounts for conduction within materials, it does not take into account heat transfer through methods such as radiation.
Thermal conduction rate, thermal current, thermal/heat flux, thermal power transfer P = / W ML 2 T −3: Thermal intensity I = / W⋅m −2: MT −3: Thermal/heat flux density (vector analogue of thermal intensity above) q
In thermal engineering, the logarithmic mean temperature difference (LMTD) is used to determine the temperature driving force for heat transfer in flow systems, most notably in heat exchangers. The LMTD is a logarithmic average of the temperature difference between the hot and cold feeds at each end of the double pipe exchanger.
Thermal Conductivity: Theory, Properties, and Applications. Springer Science & Business Media. ISBN 978-0-306-48327-1. Younes Shabany (2011). Heat Transfer: Thermal Management of Electronics. CRC Press. ISBN 978-1-4398-1468-0. Xingcun Colin Tong (2011). Advanced Materials for Thermal Management of Electronic Packaging. Springer Science ...
The number of transfer units (NTU) method is used to calculate the rate of heat transfer in heat exchangers (especially parallel flow, counter current, and cross-flow exchangers) when there is insufficient information to calculate the log mean temperature difference (LMTD). Alternatively, this method is useful for determining the expected heat ...