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For sheet metal forming analysis within the metal forming process, a successful technique requires a non-contact optical 3D deformation measuring system. The system analyzes, calculates and documents deformations of sheet metal parts, for example. It provides the 3D coordinates of the component's surface as well as the distribution of major and ...
The thickness of gold plating on jewellery is noted in microns (or micro-meters). The microns of thickness determines how long the gold plating lasts with usage. The jewellery industry denotes different qualities of gold plating in the following terminology Gold flashed / Gold washed - gold layer thickness less than 0.5 micron
The plating industry received a big boost with the advent of the development of electric generators in the late 19th century. With the higher currents available, metal machine components, hardware, and automotive parts requiring corrosion protection and enhanced wear properties, along with better appearance, could be processed in bulk.
Gold is a good conductor with a resistivity of 2.44 × 10 −8 Ω·m and is essentially nonmagnetic: = 1, so its skin depth at a frequency of 50 Hz is given by = = Lead, in contrast, is a relatively poor conductor (among metals) with a resistivity of 2.2 × 10 −7 Ω·m , about 9 times that of gold.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
In most of the world, sheet metal thickness is consistently specified in millimeters. In the U.S., the thickness of sheet metal is commonly specified by a traditional, non-linear measure known as its gauge. The larger the gauge number, the thinner the metal. Commonly used steel sheet metal ranges from 30 gauge to about 7 gauge.
Today the metal forming industry is making increasing use of simulation to evaluate the performing of dies, processes and blanks prior to building try-out tooling. Finite element analysis (FEA) is the most common method of simulating sheet metal forming operations to determine whether a proposed design will produce parts free of defects such as fracture or wrinkling.
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]