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Diagram of a laser cutter Laser cutting process on a sheet of steel CAD (top) and stainless steel laser-cut part (bottom) Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
Laser engraving metal plates are manufactured with a finely polished metal, coated with an enamel paint made to be "burned off". At levels of 10 to 30 watts, excellent engravings are made as the enamel is removed quite cleanly. Much laser engraving is sold as exposed brass or silver-coated steel lettering on a black or dark-enamelled background.
Laser types with distinct laser lines are shown above the wavelength bar, while below are shown lasers that can emit in a wavelength range. The height of the lines and bars gives an indication of the maximal power/pulse energy commercially available, while the color codifies the type of laser material (see the figure description for details).
Learn how to download and install or uninstall the Desktop Gold software and if your computer meets the system requirements.
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