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When the CPU uses power management features to reduce energy use, other components, such as the motherboard and chipset, take up a larger proportion of the computer's energy. In applications where the computer is often heavily loaded, such as scientific computing, performance per watt (how much computing the CPU does per unit of energy) becomes ...
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation.
Heat transfer by radiation is a function of both the heat-sink temperature and the temperature of the surroundings that the heat sink is optically coupled with. When both of these temperatures are on the order of 0 °C to 100 °C, the contribution of radiation compared to convection is generally small, and this factor is often neglected.
The dynamic power (switching power) dissipated by a chip is C·V 2 ·A·f, where C is the capacitance being switched per clock cycle, V is voltage, A is the Activity Factor [1] indicating the average number of switching events per clock cycle by the transistors in the chip (as a unitless quantity) and f is the clock frequency.
Reduced cooling demands makes it easier to quiet a computer. Lower energy consumption can also make it less costly to run, and reduce the environmental impact of powering the computer (see green computing). If installed where there is limited climate control, a lower power computer will operate at a lower temperature, which may make it more ...
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This cools the heat sink and whatever it is in direct thermal contact with. Use of fluids (for example coolants in refrigeration) and thermal interface material (in cooling electronic devices) ensures good transfer of thermal energy to the heat sink. Similarly, a fan may improve the transfer of thermal energy from the heat sink to the air.