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Spare parts maintained at this level of repair are known as bench stock. Intermediate-level maintenance deployment can vary widely, and is highly dependent on desired operating conditions. In minimal maintenance concepts, there may be minimal or no I-level maintenance, a system known as two-level maintenance (O-level
Mass processing techniques are not applicable to single device repair or replacement, and specialized manual techniques by expert personnel using appropriate equipment are required to replace defective components; area array packages such as ball grid array (BGA) devices particularly require expertise and appropriate tools.
Manufacturers may not support component-level repair of printed circuit boards because of the relatively low cost to replace compared with the time and cost of troubleshooting to a component level. In board-level repair, the technician identifies the board (PCA) on which the fault resides and replaces it.
FMECA may be performed at the functional or piece-part level. Functional FMECA considers the effects of failure at the functional block level, such as a power supply or an amplifier. Piece-part FMECA considers the effects of individual component failures, such as resistors, transistors, microcircuits, or valves.
Troubleshooting is a form of problem solving, often applied to repair failed products or processes on a machine or a system.It is a logical, systematic search for the source of a problem in order to solve it, and make the product or process operational again.
Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause ...
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A part failure mode is the way in which a component failed "functionally" on the component level. Often a part has only a few failure modes. For example, a relay may fail to open or close contacts on demand. The failure mechanism that caused this can be of many different kinds, and often multiple factors play a role at the same time.