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A mechanical part is often exposed to a complex, often random, sequence of loads, large and small. In order to assess the safe life of such a part using the fatigue damage or stress/strain-life methods the following series of steps is usually performed:
Low cycle fatigue (LCF) has two fundamental characteristics: plastic deformation in each cycle; and low cycle phenomenon, in which the materials have finite endurance for this type of load. The term cycle refers to repeated applications of stress that lead to eventual fatigue and failure; low-cycle pertains to a long period between applications.
A crucial part of a vibration fatigue analysis is the modal analysis, that exposes the natural modes and frequencies of the vibrating structure and enables accurate prediction of the local stress responses for the given excitation. Only then, when the stress responses are known, can vibration fatigue be successfully characterized.
Understanding the Bauschinger effect is crucial for predicting material behavior under such conditions and designing components with improved fatigue resistance. Research in this domain focuses on characterizing the Bauschinger effect in alloys and developing predictive models to assess fatigue life, [ 11 ] ensuring structural integrity and ...
The term fatigue refers to the effect of cyclic or intermittent loads. Cyclic loading due to either oscillating mechanical stress or to alternate heating and cooling is more detrimental than static loading. Under cyclic load, cracks initiate at localized sites within the part and these extend in size during cycling.
Within the branch of materials science known as material failure theory, the Goodman relation (also called a Goodman diagram, a Goodman-Haigh diagram, a Haigh diagram or a Haigh-Soderberg diagram) is an equation used to quantify the interaction of mean and alternating stresses on the fatigue life of a material. [1]
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress of solder as a result of repeated temperature fluctuations, mechanical vibrations, or mechanical loads.
Fatigue alone is the driving cause of failure in this case, causing the material to fail before oxidation can have much of an effect. [1] TMF still is not fully understood. There are many different models to attempt to predict the behavior and life of materials undergoing TMF loading. The two models presented below take different approaches.