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  2. Transient liquid phase diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Transient_liquid_phase...

    Transient liquid phase diffusion bonding is a process that differs from diffusion bonding. In transient liquid phase diffusion bonding, an element or alloy with a lower melting point in an interlayer diffuses into the lattice and grain boundaries of the substrates at the bonding temperature. Solid state diffusional processes lead to a change of ...

  3. Template:Table of phase transitions - Wikipedia

    en.wikipedia.org/wiki/Template:Table_of_phase...

    Main page; Contents; Current events; Random article; About Wikipedia; Contact us; Help; Learn to edit; Community portal; Recent changes; Upload file

  4. Terrace ledge kink model - Wikipedia

    en.wikipedia.org/wiki/Terrace_ledge_kink_model

    The energy required to remove an atom from the surface depends on the number of bonds to other surface atoms which must be broken. For a simple cubic lattice in this model, each atom is treated as a cube and bonding occurs at each face, giving a coordination number of 6 nearest neighbors. Second-nearest neighbors in this cubic model are those ...

  5. Liquid phase sintering - Wikipedia

    en.wikipedia.org/wiki/Liquid_phase_sintering

    Liquid phase sintering is a sintering technique that uses a liquid phase to accelerate the interparticle bonding of the solid phase. In addition to rapid initial particle rearrangement due to capillary forces, mass transport through liquid is generally orders of magnitude faster than through solid, enhancing the diffusional mechanisms that drive densification. [1]

  6. Template:Wafer bonding - Wikipedia

    en.wikipedia.org/wiki/Template:Wafer_bonding

    A navigational box that can be placed at the bottom of articles. Template parameters [Edit template data] Parameter Description Type Status State state The initial visibility of the navbox Suggested values collapsed expanded autocollapse String suggested Template transclusions Transclusion maintenance Check completeness of transclusions The above documentation is transcluded from Template ...

  7. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...

  8. Time-resolved spectroscopy - Wikipedia

    en.wikipedia.org/wiki/Time-resolved_spectroscopy

    In physics and physical chemistry, time-resolved spectroscopy is the study of dynamic processes in materials or chemical compounds by means of spectroscopic techniques.Most often, processes are studied after the illumination of a material occurs, but in principle, the technique can be applied to any process that leads to a change in properties of a material.

  9. Phase response curve - Wikipedia

    en.wikipedia.org/wiki/Phase_response_curve

    A phase response curve (PRC) illustrates the transient change (phase response) in the cycle period of an oscillation induced by a perturbation as a function of the phase at which it is received. PRCs are used in various fields; examples of biological oscillations are the heartbeat, circadian rhythms , and the regular, repetitive firing observed ...