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  2. Copper electroplating - Wikipedia

    en.wikipedia.org/wiki/Copper_electroplating

    Copper electroplating. Copper plating on aluminium. Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. [ 1 ] The copper layer can be decorative, provide corrosion resistance ...

  3. Electroless copper plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_copper_plating

    Electroless copper plating. Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde. [1]

  4. Electroplating - Wikipedia

    en.wikipedia.org/wiki/Electroplating

    Electroplating. Copper electroplating machine for layering PCBs. Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current. The part to be coated acts as the cathode (negative ...

  5. Copper interconnects - Wikipedia

    en.wikipedia.org/wiki/Copper_interconnects

    For the Cu deposition (i.e. an additive manufacturing process), the IBM team in the late 1990’s selected electroplating. This started the ‘copper revolution” in the semiconductor / microchip industry. The copper plating starts with coating the walls of a via with a protective layer (Ta, TaN, SiN or SiC), that prevents Cu diffusion into ...

  6. Copper foil - Wikipedia

    en.wikipedia.org/wiki/Copper_foil

    Copper foil is a thin sheet of copper metal that is widely used in various applications due to its excellent electrical conductivity, malleability, and corrosion resistance. It is an essential material in the electronics industry, especially for manufacturing printed circuit boards (PCBs) and other electronic components.

  7. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    1/2 oz/ft 2 foil is not widely used as a finished copper weight, but is used for outer layers when plating for through holes will increase the finished copper weight Some PCB manufacturers refer to 1 oz/ft 2 copper foil as having a thickness of 35 μm (may also be referred to as 35 μ, 35 micron, or 35 mic).

  8. Electrogalvanization - Wikipedia

    en.wikipedia.org/wiki/Electrogalvanization

    The chosen content of zinc depends on the required productivity and part configuration. High zinc improves the bath's efficiency (plating speed), while lower levels improve the bath's ability to throw into low current densities. Typically, the Zn metal level varies between 20 and 50 g/L (2.7-6.7 oz/gal). The pH varies between 4.8 and 5.8 units.

  9. Metalworking - Wikipedia

    en.wikipedia.org/wiki/Metalworking

    Metalworking is the process of shaping and reshaping metals in order to create useful objects, parts, assemblies, and large scale structures. As a term, it covers a wide and diverse range of processes, skills, and tools for producing objects on every scale: from huge ships, buildings, and bridges, down to precise engine parts and delicate jewelry.

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