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2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Solder paste is used in the manufacture of ... in size and have a low ... room temperature for use. Recently, new solder pastes have been introduced that remain ...

3. Solder alloys - Wikipedia

   en.wikipedia.org/wiki/Solder_alloys

   Cd70, thermal-free solder. Produces low thermal EMF joints in copper, does not form parasitic thermocouples. Used in low-temperature physics. [2] Sn 40 Pb 42 Cd 18: 145: Cd, Pb: Low melting temperature allows repairing pewter and zinc objects, including die-cast toys. Sn 50 Pb 32 Cd 18: 145 [16] Cd, Pb: Cd18: Cd 82.5 Zn 17.5: 265 [27] Cd: Yes

4. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   Reflow soldering is a process in which a solder paste (a mixture of prealloyed solder powder and a flux-vehicle that has a peanut butter-like consistency [8]) is used to stick the components to their attachment pads, after which the assembly is heated by an infrared lamp, a hot air pencil, or, more commonly, by passing it through a carefully ...

5. Reflow soldering - Wikipedia

   en.wikipedia.org/wiki/Reflow_soldering

   Too high a temperature can lead to solder spattering or balling as well as oxidation of the paste, the attachment pads and the component terminations. Similarly, fluxes may not fully activate if the temperature is too low. At the end of the soak zone a thermal equilibrium of the entire assembly is desired just before the reflow zone. A soak ...

6. Glass frit bonding - Wikipedia

   en.wikipedia.org/wiki/Glass_frit_bonding

   Lead-free solder glasses with soldering temperature of 450 °C (842 °F) were also developed. Phosphate glasses with low melting temperature were developed. One of such compositions is phosphorus pentoxide, lead(II) oxide, and zinc oxide, with addition of lithium and some other oxides. [19] Electrically conductive glass solders can be also ...

7. Tin-silver-copper - Wikipedia

   en.wikipedia.org/wiki/Tin-silver-copper

   Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]