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Drypoint is a printmaking technique of the intaglio family, in which an image is incised into a plate (or "matrix") with a hard-pointed "needle" of sharp metal or diamond point. In principle, the method is practically identical to engraving .
Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface.
The plate's ground side is then dipped into acid, or the acid poured onto it. The acid bites into the surface of the plate where it was exposed. Biting is a printmaking term to describe the acid's etching, or incising, of the image; its duration depends on the acid strength, metal's reactivity, temperature, air pressure and the depth desired. [8]
Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography.
Much greater pressure is then needed to force the paper into the channels containing the ink, so a high-pressure press is normally needed. Intaglio techniques include engraving, etching, and drypoint. In the planographic family of printing, the entire surface of the matrix is flat, and some areas are treated to create the print image. [1]
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching . RIE uses chemically reactive plasma to remove material deposited on wafers .
Etching is the removal of some portion of the thin film or substrate. The substrate is exposed to an etching (such as an acid or plasma) which chemically or physically attacks the film until it is removed. Etching techniques include: Dry etching (plasma etching) such as reactive-ion etching (RIE) or deep reactive-ion etching (DRIE)
Deep reactive-ion etching (DRIE) is a special subclass of reactive-ion etching (RIE). It enables highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers /substrates, typically with high aspect ratios .