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A varial flip is a type of skateboarding trick in which the skateboard rotates around its vertical axis, or its vertical axis and its horizontal axis simultaneously. The first flip trick, called a kickflip but originally known as a "magic flip", was invented by professional skateboarder Rodney Mullen.
FLIP is often used and is closely associated with Fluorescence recovery after photobleaching (FRAP). The major difference between these two microscopy techniques is that FRAP involves the study of a cell’s ability to recover after a single photobleaching event whereas FLIP involves the study of how the loss of fluorescence spreads throughout ...
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Most LaserDisc players required the user to manually turn the disc over to play the other side. A number of players (all diode laser based) were made that were capable of playing both sides of the disc automatically, using a mechanism to physically flip a single laser pickup. Pioneer produced some multi-disc models which held more than 50 ...
The 360 Kickflip, 360 Flip, Trè Flip or 3 Flip is a skateboarding trick invented by Rodney Mullen. [1] This trick is a combination of a 360 pop shove-it and a kickflip. The 360 Kickflip has become a standard street trick and has also come to be one of the most recognizable. The 360 flips are often stylized by catching with the front foot first.
Laser printing is an electrostatic digital printing process. It produces high-quality text and graphics (and moderate-quality photographs) by repeatedly passing a laser beam back and forth over a negatively charged cylinder called a "drum" to define a differentially charged image. [1]
A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.