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Thermal contact resistance is significant and may dominate for good heat conductors such as metals but can be neglected for poor heat conductors such as insulators. [2] Thermal contact conductance is an important factor in a variety of applications, largely because many physical systems contain a mechanical combination of two materials.
R = Resistance(s) to heat flow in pipe wall (K/W) Other parameters are as above. [16] The heat transfer coefficient is the heat transferred per unit area per kelvin. Thus area is included in the equation as it represents the area over which the transfer of heat takes place. The areas for each flow will be different as they represent the contact ...
This is due to the way that metals bond chemically: metallic bonds (as opposed to covalent or ionic bonds) have free-moving electrons that transfer thermal energy rapidly through the metal. The electron fluid of a conductive metallic solid conducts most of the heat flux through the solid. Phonon flux is still present but carries less of the energy.
To avoid losses, the conductivity of the tube material must be high. In high current situations where conductors (round or flat busbar) may be between 5 and 50 mm thick skin effect also occurs at sharp bends where the metal is compressed inside the bend and stretched outside the bend. The shorter path at the inner surface results in a lower ...
A laptop computer heat pipe system. A heat pipe is a heat-transfer device that employs phase transition to transfer heat between two solid interfaces. [1]At the hot interface of a heat pipe, a volatile liquid in contact with a thermally conductive solid surface turns into a vapor by absorbing heat from that surface.
An example of steady state conduction is the heat flow through walls of a warm house on a cold day—inside the house is maintained at a high temperature and, outside, the temperature stays low, so the transfer of heat per unit time stays near a constant rate determined by the insulation in the wall and the spatial distribution of temperature ...
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The critical heat flux is an important point on the boiling curve and it may be desirable to operate a boiling process near this point. However, one could become cautious of dissipating heat in excess of this amount. Zuber, [6] through a hydrodynamic stability analysis of the problem has developed an expression to approximate this point.