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When a CPU heat spreader is coupled to the die via thermal paste, performance enthusiasts such as overclockers are able to, in a process known as "delidding", [3] pry the heat spreader, or CPU "lid", from the die. This allows them to replace the thermal paste, which is usually of low-quality, with a thermal paste having greater thermal ...
Thermal compound is commonly used to enhance the thermal conductivity from the CPU, GPU, or any heat-producing components to the heatsink cooler. (Counterclockwise from top left: Arctic MX-2, Arctic MX-4, Tuniq TX-4, Antec Formula 7, Noctua NT-H1).
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of a material with a high thermal conductivity , such as aluminium or copper.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
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This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock ...
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