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  2. Transient liquid phase diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Transient_liquid_phase...

    Transient liquid phase diffusion bonding is a process that differs from diffusion bonding. In transient liquid phase diffusion bonding, an element or alloy with a lower melting point in an interlayer diffuses into the lattice and grain boundaries of the substrates at the bonding temperature. Solid state diffusional processes lead to a change of ...

  3. Liquid phase sintering - Wikipedia

    en.wikipedia.org/wiki/Liquid_phase_sintering

    Liquid phase sintering is a sintering technique that uses a liquid phase to accelerate the interparticle bonding of the solid phase. In addition to rapid initial particle rearrangement due to capillary forces, mass transport through liquid is generally orders of magnitude faster than through solid, enhancing the diffusional mechanisms that drive densification. [1]

  4. Template:Wafer bonding - Wikipedia

    en.wikipedia.org/wiki/Template:Wafer_bonding

    A navigational box that can be placed at the bottom of articles. Template parameters [Edit template data] Parameter Description Type Status State state The initial visibility of the navbox Suggested values collapsed expanded autocollapse String suggested Template transclusions Transclusion maintenance Check completeness of transclusions The above documentation is transcluded from Template ...

  5. Host–guest chemistry - Wikipedia

    en.wikipedia.org/wiki/Host–guest_chemistry

    Host–guest chemistry encompasses the idea of molecular recognition and interactions through non-covalent bonding. Non-covalent bonding is critical in maintaining the 3D structure of large molecules, such as proteins and is involved in many biological processes in which large molecules bind specifically but transiently to one another.

  6. Template:Table of phase transitions - Wikipedia

    en.wikipedia.org/wiki/Template:Table_of_phase...

    Main page; Contents; Current events; Random article; About Wikipedia; Contact us; Pages for logged out editors learn more

  7. Thermocompression bonding - Wikipedia

    en.wikipedia.org/wiki/Thermocompression_bonding

    The bonding temperature can be lowered using a higher applied pressure and vice versa, considering that high pressure increases the chances of damage to the structural material or the films. [8] The bonding process itself takes place in a vacuum or forming gas environment, e.g. N 2. [10]

  8. Plasma-activated bonding - Wikipedia

    en.wikipedia.org/wiki/Plasma-activated_bonding

    Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE) .

  9. Time-resolved spectroscopy - Wikipedia

    en.wikipedia.org/wiki/Time-resolved_spectroscopy

    In physics and physical chemistry, time-resolved spectroscopy is the study of dynamic processes in materials or chemical compounds by means of spectroscopic techniques.Most often, processes are studied after the illumination of a material occurs, but in principle, the technique can be applied to any process that leads to a change in properties of a material.