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  2. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    Two heat sink attachment methods, namely the maxiGRIP (left) and Talon Clip (right) Clips. Available for processors and ball grid array (BGA) components, clips allow the attachment of a BGA heat sink directly to the component. The clips make use of the gap created by the ball grid array (BGA) between the component underside and PCB top surface.

  3. Heat spreader - Wikipedia

    en.wikipedia.org/wiki/Heat_spreader

    A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. There are two thermodynamic types, passive and active. The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond. An active heat spreader speeds up heat ...

  4. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...

  5. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  6. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...

  7. Thermal management of high-power LEDs - Wikipedia

    en.wikipedia.org/wiki/Thermal_management_of_high...

    Heat pipes may also be added to aluminum or copper heat sinks to reduce spreading resistance. Shape – Thermal transfer takes place at the surface of the heat sink. Therefore, heat sinks should be designed to have a large surface area. This goal can be reached by using a large number of fine fins or by increasing the size of the heat sink itself.

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  9. Copper in heat exchangers - Wikipedia

    en.wikipedia.org/wiki/Copper_in_heat_exchangers

    An alternative to all-copper or all-aluminum heat sinks is the joining of aluminum fins to a copper base. [47] Copper heat sinks are die-cast and bound together in plates. They spread heat quickly from the heat source to copper or aluminum fins and into the surrounding air. Heat pipes are used to move heat away from central processing units ...

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