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An antistatic bag is a bag used for storing electronic components, which are prone to damage caused by electrostatic discharge (ESD). These bags are usually plastic polyethylene terephthalate (PET) and have a distinctive color (silvery for metallised film, pink or black for polyethylene).
Plastic small-outline package [3] PSON: Plastic small-outline no-lead package: QSOP: Quarter-size small-outline package: The terminal pitch is 0.635 mm. [3] SOIC: Small-outline integrated circuit: Also known as SOIC NARROW and SOIC WIDE: SOJ: Small-outline J-leaded package SON Small-outline no-lead package SSOP: Shrink small-outline package [3 ...
A transparent plastic housing around an electronic device. In engineering, a housing or enclosure is a container, a protective exterior (e.g. shell) or an enclosing structural element (e.g. chassis or exoskeleton) designed to enable easier handling, provide attachment points for internal mechanisms (e.g. mounting brackets for electrical components, cables and pipings), maintain cleanliness of ...
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .
Airtight implies both waterproof and vapor-proof. Applications for hermetic sealing include semiconductor electronics, thermostats, optical devices, MEMS, and switches. Electrical or electronic parts may be hermetic sealed to secure against water vapor and foreign bodies to maintain proper functioning and reliability.
Cost is a factor in selection of integrated circuit packaging. Typically, an inexpensive plastic package can dissipate heat up to 2W, which is sufficient for many simple applications, though a similar ceramic package can dissipate up to 50W in the same scenario. [1] As the chips inside the package get smaller and faster, they also tend to get ...
In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound. This is done to exclude water, moisture, or corrosive agents, to increase resistance to shocks and vibrations, or to prevent gaseous phenomena such as corona discharge in high-voltage assemblies.
A flexible intermediate bulk container (FIBC), jumbo bag, bulk bag, super sack or a big bag is an industrial container made of flexible fabric that is designed for storing and transporting dry, flowable products, such as sand, fertilizer, and granules of plastic. [1] [2] [3]
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