Search results
Results from the WOW.Com Content Network
Another potential problem is that filament degradation in the electron gun results in a non-uniform evaporation rate. However, when vapor deposition is performed at pressures of roughly 10 −4 Torr (1.3 × 10 −4 hPa) or higher, significant scattering of the vapor cloud takes place such that surfaces not in sight of the source can be coated ...
Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a ...
RNA folding problem: Is it possible to accurately predict the secondary, tertiary and quaternary structure of a polyribonucleic acid sequence based on its sequence and environment? Protein design : Is it possible to design highly active enzymes de novo for any desired reaction?
Electron-beam machining is a process in which high-velocity electrons are concentrated into a narrow beam with a very high planar power density. The beam cross-section is then focused and directed toward the work piece, creating heat and vaporizing the material. Electron-beam machining can be used to accurately cut or bore a wide variety of metals.
Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films .
In chemistry, a precursor is a compound that contributes in a chemical reaction and produces another compound, or a chemical substance that gives rise to another more significant chemical product. Since several years metal-organic compounds are widely used as molecular precursors for the chemical vapor deposition process (MOCVD).
Plasma (argon-only on the left, argon and silane on the right) inside a prototype LEPECVD reactor at the LNESS laboratory in Como, Italy.. Low-energy plasma-enhanced chemical vapor deposition (LEPECVD) is a plasma-enhanced chemical vapor deposition technique used for the epitaxial deposition of thin semiconductor (silicon, germanium and SiGe alloys) films.
In chemistry, deposition occurs when molecules settle out of a solution. Deposition can be defined as the process of direct transition of a substance from its gaseous form, on cooling, into a solid state without passing through the intermediate liquid state. [1] Deposition can be viewed as a reverse process to dissolution or particle re ...