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LGA 1151, [1] also known as Socket H4, is a type of zero insertion force flip-chip land grid array (LGA) socket for Intel desktop processors which comes in two distinct versions: the first revision which supports both Intel's Skylake [2] and Kaby Lake CPUs, and the second revision which supports Coffee Lake CPUs exclusively.
LGA 1151 DMI 3.0 August 2017 CM8067702870937; $450 "Kaby Lake-H" (14 nm) Mobile Workstation. ... List of Intel Xeon processors (Kaby Lake-based)
LGA 1151 DMI 3.0 October 2015 CM8066201935808; $278 "Skylake-H" (14 nm) Mobile Workstation. ... Support for up to 12 DIMMs of DDR4 memory per CPU socket;
LGA 1156 LGA 1155 LGA 1150 LGA 1151 LGA 1200 LGA 1700: Intel 7, 14 nm, 22 nm, 32 nm, 45 nm, 65 nm 2.9 W – 73 W 1 or 2, 2 /w hyperthreading 800 MHz, 1066 MHz, 2.5GT/s, 5 GT/s 64 KiB per core 2x256 KiB – 2 MiB 0 KiB – 3 MiB Intel Core: Txxxx Lxxxx Uxxxx Yonah: 2006–2008 1.06 GHz – 2.33 GHz Socket M: 65 nm 5.5 W – 49 W 1 or 2
List of Intel Xeon processors (Coffee Lake-based) Add languages. Add links. Article; Talk; English. Read; ... LGA 1151 DMI 3.0 11 June 2019 CM8068404196302; OEM Low ...
Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink. This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.
The latest standard badge design used by Intel to promote the Celeron brand. The Celeron was a family of microprocessors from Intel targeted at the low-end consumer market. . CPUs in the Celeron brand have used designs from sixth- to eighth-generation CPU microarchitectur
CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands and ensuring a good connection, as well as increased mechanical stability.
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