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3D Cross Point 2 layer diagram Intel Optane in M.2 card format. 3D XPoint (pronounced three-D cross point) is a discontinued non-volatile memory (NVM) technology developed jointly by Intel and Micron Technology. It was announced in July 2015 and was available on the open market under the brand name Optane (Intel) from April 2017 to July 2022. [1]
64-Layer 3D TLC PCIe 3.1 x4 NVMe M.2 Silicon Motion SM2262 3230/1625 340/275 January 2018 Endurance: 72 TB to 288 TB, Power Active Average: 0.05W [91] Pro 7600p Harris Harbor 128/256/512/1024/2048 64-Layer 3D TLC PCIe 3.1 x4 NVMe M.2 Silicon Motion SM2262 3230/1625 340/275 January 2018 Endurance: 72 TB to 576 TB, Power Active Average: 0.05W
Coffee Lake-U-based Bean Canyon Intel NUC (NUC8i5BEK2) Motherboard of a 6th generation NUC (Model NUC6i3SYH), extended with two 8 GB RAM modules. Next Unit of Computing (NUC) is a line of small-form-factor barebone computer kits designed by Intel.
The 100 Series chipsets (codenamed Sunrise Point), for Skylake processors using the LGA 1151 socket, [90] were released in the third quarter of 2015. [91] The 200 Series chipsets (codenamed Union Point) were introduced along with Kaby Lake processors, which also use the LGA 1151 socket; [92] these were released in the first quarter of 2017. [93]
In 2017, Intel introduced SSDs based on 3D XPoint technology under the Optane brand. Unlike NAND flash, 3D XPoint uses a different method to store data, offering higher IOPS performance, although sequential read and write speeds remain slower compared to traditional SSDs.
Other enhancements include Thunderbolt 3.0, Serial ATA Express, Iris Pro graphics with Direct3D feature level 12_1 with up to 128 MB of L4 eDRAM cache on certain SKUs. [56] The Skylake line of processors retires VGA support, [ 57 ] while supporting up to three monitors connected via HDMI 1.4, DisplayPort 1.2 or Embedded DisplayPort (eDP ...
Cascade Lake is an Intel codename for a 14 nm server, workstation and enthusiast processor generation, launched in April 2019. [3] [4] In Intel's process–architecture–optimization model, Cascade Lake is an optimization of Skylake.
IM Flash Technologies, LLC was the semiconductor company founded in January 2006, by Intel Corporation and Micron Technology, Inc. IM Flash produced 3D XPoint used in data centers and high end computers. It had a 300mm wafer fab in Lehi, Utah, United States. It built a second 300mm wafer fab, IM Flash Singapore, which opened in April 2011. [1]
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