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Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...
During the compliant bonding cycle the bond pressure is uniquely controlled by the inherent flow properties of the aluminum compliant tape (Figure 3). Therefore, if higher bond pressures are needed to increase the final deformation (flatness) of a compliant bonded gold wire, a higher yielding alloy of aluminum could be employed.
Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is commonly used in the semiconductor industry . Wedge bonding is directional, so the bonding head rotates to accommodate the different angles for bonding.
The resulting weld is quite different in appearance from the ball bond, and is referred to as the wedge bond, tail bond, or simply as the second bond. In the final step the machine pays out a small length of wire and tears the wire from the surface using a set of clamps. This leaves a small tail of wire hanging from the end of the capillary ...
Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding" by George Harman, [ 1 ] the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics .
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This pottery kit is a great bonding activity that has a variety of Valentine's Day-themed projects (sweetheart coasters, XO tic-tac-toe, and more). Pott'd $158.00 at getpottd.com
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