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Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...
During the compliant bonding cycle the bond pressure is uniquely controlled by the inherent flow properties of the aluminum compliant tape (Figure 3). Therefore, if higher bond pressures are needed to increase the final deformation (flatness) of a compliant bonded gold wire, a higher yielding alloy of aluminum could be employed.
Tape-automated bonding: Variation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires. Used by LCD driver ICs. COG: Chip-on-glass: Variation of TAB, where a chip is mounted directly to a piece of glass - typically an LCD. Used by LCD and OLED driver ICs.
He was named "father of thermosonic bonding" by George Harman, [1] the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics. [2] [3] A thermosonic bond is formed using a set of parameters which include ultrasonic, thermal and mechanical (force) energies.
Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding" by George Harman, [ 1 ] the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics .
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Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is commonly used in the semiconductor industry . Wedge bonding is directional, so the bonding head rotates to accommodate the different angles for bonding.
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