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  2. SMTC Corporation - Wikipedia

    en.wikipedia.org/wiki/SMTC_Corporation

    SMTC Corporation (Surface Mount Technology Centre), founded in 1985, is a mid-size provider of end-to-end electronics manufacturing services (EMS) including PCBA production, systems integration and comprehensive testing services, enclosure fabrication, as well as product design, sustaining engineering and supply chain management services.

  3. Pick-and-place machine - Wikipedia

    en.wikipedia.org/wiki/Pick-and-place_machine

    Surface mount components are placed along the front (and often back) faces of the machine. Most components are supplied on paper or plastic tape, in tape reels that are loaded onto feeders mounted to the machine. Larger integrated circuits (ICs) are sometimes supplied and arranged in trays which are stacked in a compartment. More commonly used ...

  4. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).

  5. SMEMA - Wikipedia

    en.wikipedia.org/wiki/Smema

    SMEMA is an acronym for the Surface Mount Equipment Manufacturers Association.. In 1999 they merged with the IPC to form the IPC SMEMA Council. [1]One standard they have is for the wiring of communications between Surface mount technology producing machinery such as a Stencil Printer or a Pick and Place Machine on an Electronics production line.

  6. ASM International - Wikipedia

    en.wikipedia.org/wiki/ASM_International

    The shares of the company are listed on the Euronext Amsterdam. In March 2020, ASM was promoted to the AEX index. [4] ASM has a minority stake in ASM Pacific Technology, a Hong Kong–based company active in semiconductor assembly, packaging and surface-mount technology.

  7. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...

  8. Ball grid array - Wikipedia

    en.wikipedia.org/wiki/Ball_grid_array

    A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just ...

  9. Small-outline transistor - Wikipedia

    en.wikipedia.org/wiki/Small-outline_transistor

    A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations,. [ 1 ] SOT23-5 differs from SOT23 in a wider body of 1.6 mm (0.063 in) instead of 1.3 mm (0.051 in).