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Cathodic arc deposition or Arc-PVD is a physical vapor deposition technique in which an electric arc is used to vaporize material from a cathode target. The vaporized material then condenses on a substrate, forming a thin film. The technique can be used to deposit metallic, ceramic, and composite films.
Ion beam deposition (IBD) is a process of applying materials to a target through the application of an ion beam. [1] Ion beam deposition setup with mass separator. An ion beam deposition apparatus typically consists of an ion source, ion optics, and the deposition target. Optionally a mass analyzer can be incorporated. [2]
Download as PDF; Printable version; ... Applications of 3D printing; ... Cathodic arc deposition; Cativa process; Ceramic engineering;
Cathodic arc deposition: a high-power electric arc discharged at the target (source) material blasts away some into highly ionized vapor to be deposited onto the workpiece. Electron-beam physical vapor deposition : the material to be deposited is heated to a high vapor pressure by electron bombardment in "high" vacuum and is transported by ...
Electrophoretic deposition (EPD), is a term for a broad range of industrial processes which includes electrocoating, cathodic electrodeposition, anodic electrodeposition, and electrophoretic coating, or electrophoretic painting.
Vacuum deposition is a group of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure (i.e., vacuum ).
In contrast, DLC is typically produced by processes in which high energy precursive carbons (e.g. in plasmas, in filtered cathodic arc deposition, in sputter deposition and in ion beam deposition) are rapidly cooled or quenched on relatively cold surfaces. In those cases cubic and hexagonal lattices can be randomly intermixed, layer by atomic ...
The limit is determined by the transition of the discharge from glow to arc phase. The peak power and the duty cycle are selected so as to maintain an average cathode power similar to conventional sputtering (1–10 W⋅cm −2). HIPIMS is used for: adhesion enhancing pretreatment of the substrate prior to coating deposition (substrate etching)