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In USB 3.0, dual-bus architecture is used to allow both USB 2.0 (Full Speed, Low Speed, or High Speed) and USB 3.0 (SuperSpeed) operations to take place simultaneously, thus providing backward compatibility. The structural topology is the same, consisting of a tiered star topology with a root hub at level 0 and hubs at lower levels to provide ...
The Hi-Speed USB logo. USB 2.0 was released in April 2000, adding a higher maximum signaling rate of 480 Mbit/s (maximum theoretical data throughput 53 MByte/s [29]) named High Speed or High Bandwidth, in addition to the USB 1.x Full Speed signaling rate of 12 Mbit/s (maximum theoretical data throughput 1.2 MByte/s). [30]
The following other wikis use this file: Usage on ast.wikipedia.org Universal Serial Bus; Usage on az.wikipedia.org USB; Usage on bg.wikipedia.org
The following other wikis use this file: Usage on de.wikipedia.org Universal Serial Bus; Usage on et.wikipedia.org Universaalne jadasiin; Usage on pt.wikipedia.org
Certified Hi-Speed USB: SVG development . The SVG code is . This text-logo was created with Adobe Illustrator. This ...
A number of extensions to the USB Specifications have progressively further increased the maximum allowable V_BUS voltage: starting with 6.0 V with USB BC 1.2, [43] to 21.5 V with USB PD 2.0 [44] and 50.9 V with USB PD 3.1, [44] while still maintaining backwards compatibility with USB 2.0 by requiring various forms of handshake before ...
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The physical phenomena on which the device relies (such as spinning platters in a hard drive) will also impose limits; for instance, no spinning platter shipping in 2009 saturates SATA revision 2.0 (3 Gbit/s), so moving from this 3 Gbit/s interface to USB 3.0 at 4.8 Gbit/s for one spinning drive will result in no increase in realized transfer rate.