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In USB 3.0, dual-bus architecture is used to allow both USB 2.0 (Full Speed, Low Speed, or High Speed) and USB 3.0 (SuperSpeed) operations to take place simultaneously, thus providing backward compatibility. The structural topology is the same, consisting of a tiered star topology with a root hub at level 0 and hubs at lower levels to provide ...
The following other wikis use this file: Usage on ast.wikipedia.org Universal Serial Bus; Usage on az.wikipedia.org USB; Usage on bg.wikipedia.org
The following other wikis use this file: Usage on de.wikipedia.org Universal Serial Bus; Usage on et.wikipedia.org Universaalne jadasiin; Usage on pt.wikipedia.org
The Hi-Speed USB logo. USB 2.0 was released in April 2000, adding a higher maximum signaling rate of 480 Mbit/s (maximum theoretical data throughput 53 MByte/s [29]) named High Speed or High Bandwidth, in addition to the USB 1.x Full Speed signaling rate of 12 Mbit/s (maximum theoretical data throughput 1.2 MByte/s). [30]
A number of extensions to the USB Specifications have progressively further increased the maximum allowable V_BUS voltage: starting with 6.0 V with USB BC 1.2, [43] to 21.5 V with USB PD 2.0 [44] and 50.9 V with USB PD 3.1, [44] while still maintaining backwards compatibility with USB 2.0 by requiring various forms of handshake before ...
Certified Hi-Speed USB: SVG development . The SVG code is . This text-logo was created with Adobe Illustrator. This ...
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Edited to correct the fill colors: white areas represent cavities in the plugs; grey areas represent volumes filled with insulating material. Als corrected the orientation of the micro plugs: on the micro-B plugs the top side (which is the side on which the USB logo is (supposed to be) stamped) has the terminals and the chamfers on the housing.
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