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2. Floor scrubber - Wikipedia

   en.wikipedia.org/wiki/Floor_scrubber

   Floor burnisher is the term for a high speed floor buffer that rotates its pad at over 1000 RPM. Closely resembling a large upright, wide-based vacuum cleaner with handlebar controls and requiring two-handed steering by beginners, a floor buffer uses one or more variable-speed circular rotary brushes to dislodge dirt and dust from and apply a ...

3. Polished concrete - Wikipedia

   en.wikipedia.org/wiki/Polished_concrete

   The polishing process begins with a 50-grit diamond resin pad instead of a metal segment. When using the resin pads the steps may be 100, then 200, 400, 800, 1600 and finally 3000+ grit. Throughout the process, a densifier is used to harden the concrete surface, which allows the concrete to be polished.

4. Floor cleaning - Wikipedia

   en.wikipedia.org/wiki/Floor_cleaning

   Vinyl composition tile or VCT is a common commercial floor type. Cleaning this type of floor is done with either a mop and bucket or with a floor scrubber. VCT requires a polymer coating or floor finish to protect it. This needs to be kept clean with dust mopping and wet cleaning (i.e. wet mopping or floor scrubber).

5. Polishing (metalworking) - Wikipedia

   en.wikipedia.org/wiki/Polishing_(metalworking)

   Buffing may be done by hand with a stationary polisher or die grinder, or it may be automated using specialized equipment. When buffing there are two types of buffing motions: the cut motion and the color motion. The cut motion is designed to give a uniform, smooth, semi-bright surface finish.

6. Polishing - Wikipedia

   en.wikipedia.org/wiki/Polishing

   Polishing is the process of creating a smooth and shiny surface by rubbing it or by applying a chemical treatment, leaving a clean surface with a significant specular reflection (still limited by the index of refraction of the material according to the Fresnel equations). [1]

7. Chemical-mechanical polishing - Wikipedia

   en.wikipedia.org/wiki/Chemical-mechanical_polishing

   The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring. The dynamic polishing head is rotated with different axes of rotation (i.e., not concentric). This removes material and tends to even out any irregular topography, making the wafer flat or planar. This may be necessary to set up the ...