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Copper fluoroborate baths are similar to acid sulfate baths, but they use fluoroborate as the anion rather than sulfate. [6] Copper fluoroborate is much more soluble than copper sulfate, which allows one to dissolve larger quantities of copper salt into the bath, enabling much higher current densities than what is possible in copper sulfate baths.
Copper plating may refer to: Copper electroplating , a technique of electroplating a layer of copper onto a metal object Electroless copper plating , an auto-catalytic chemical technique used to deposit a layer of copper on a solid workpiece
An electric current flows from the battery, through the copper anode, the electrolyte, and the coated mold. A copper film (the electrotype) grows onto the electrically conducting coating of the mold. Electrotyping (also galvanoplasty ) is a chemical method for forming metal parts that exactly reproduce a model.
cathode made of platinum or stainless steel (needle), anode nickel-plated or gold-plated copper or brass or polished steel, duration 10 s, distance between cathode and anode 3 mm . [20] An electrolyte of 100 g of litharge dissolved in 0.5 l of water can also be used in which 100 g of NaOH is dissolved.
Simplified diagram for electroplating copper (orange) on a conductive object (the cathode, "Me", gray). The electrolyte is a solution of copper sulfate, CuSO 4 in sulfuric acid. A copper anode is used to replenish the electrolyte with copper cations Cu 2+ as they are plated out at the cathode.
The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde. [ 1 ] Unlike electroplating , electroless plating processes in general do not require passing an electric current through the bath and the substrate; the reduction of the metal cations in solution to metallic is ...
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
The addition of Grignard reagents to alkynes is facilitated by a catalytic amount of copper halide. Transmetalation to copper and carbocupration are followed by transmetalation of the product alkene back to magnesium. The addition is syn unless a coordinating group is nearby in the substrate, in which case the addition becomes anti and yields ...