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An example of an electrical force gauge is an "electronic scale". One or more electrical load cells (commonly referred to as "weigh bars") are used to support a vertical or horizontal "live load" and are solid-state potentiometers which have variable internal resistance proportional to the load they are subjected to and deflected by. As the ...
A Class B push–pull output driver using a pair of complementary PNP and NPN bipolar junction transistors configured as emitter followers. A push–pull amplifier is a type of electronic circuit that uses a pair of active devices that alternately supply current to, or absorb current from, a connected load. This kind of amplifier can enhance ...
Typical lectromechanical Universal Testing Machine Test fixture for three point flex test. A universal testing machine (UTM), also known as a universal tester, [1] universal tensile machine, materials testing machine, materials test frame, is used to test the tensile strength (pulling) and compressive strength (pushing), flexural strength, bending, shear, hardness, and torsion testing ...
A pull-off test, also called stud pull test, is a type of test in which an adhesive connection is made between a stud and a carrier (or object to be tested) by using a glue, possibly an epoxy or polyester resin, that is stronger than the bond that needs to be tested.
USB Tweezers performing cold bump pull (CPB) on a bond tester. Measuring bond strength by pull testing is often the best way to get the failure mode in which you are interested. Additionally, and unlike a shear test, as the bond separates, the fracture surfaces are pulled away from each other, cleanly enabling accurate failure mode analysis.
Wafer testing is a step performed during semiconductor device fabrication after back end of line (BEOL) and before IC packaging.. Two types of testing are typically done. Very basic wafer parametric tests (WPT) are performed at a few locations on each wafer to ensure the wafer fabrication process has been carried out successfully.
A bond tester is a scientific instrument used to measure the mechanical strength of bonds, evaluate bond strength distributions or determine compliance with specified bond strength requirements of the applicable acquisition document.
The cross-cut test is a method for determining the resistance of paints and coatings to separation from substrates by utilizing a tool to cut a right-angle lattice pattern into the coating, penetrating to the substrate. A quick pass/fail test can be accomplished through this method.
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