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  2. Thermal copper pillar bump - Wikipedia

    en.wikipedia.org/wiki/Thermal_copper_pillar_bump

    A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).

  3. Vertiv - Wikipedia

    en.wikipedia.org/wiki/Vertiv

    Vertiv is an American multinational provider of critical infrastructure and services for data centers, communication networks, and commercial and industrial environments. ...

  4. Aerosol burn - Wikipedia

    en.wikipedia.org/wiki/Aerosol_burn

    There are documented cases using both conservative and invasive treatments, including skin grafting and/or the application of nonadhesive dressing alongside topical corticosteroids to reduce inflammation. However, the use of steroids may exacerbate fungal infections if the aerosol product used is an antifungal medicine.

  5. Non-contact thermography - Wikipedia

    en.wikipedia.org/wiki/Non-contact_thermography

    Sample image of a hand held thermography camera. There is a difference between Medical Thermology as promulgated by medically based organizations such as the American Academy of Thermology (AAT), and thermography as practiced by alternative providers or physicians who overstate the benefits of thermography.

  6. Thermal treatment - Wikipedia

    en.wikipedia.org/wiki/Thermal_treatment

    Thermal treatment is any waste treatment technology that involves high temperatures in the processing of the waste feedstock. Commonly this involves the combustion of waste materials. [1] Systems that are generally considered to be thermal treatment include: Cement kiln; Gasification; Incineration; Mechanical heat treatment; Pyrolysis; Thermal ...

  7. Flip chip - Wikipedia

    en.wikipedia.org/wiki/Flip_chip

    Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.

  8. Corona treatment - Wikipedia

    en.wikipedia.org/wiki/Corona_treatment

    Many substrates provide a better bonding surface when they are treated at the time they are produced. This is called “pre-treatment.” The effects of corona treatment diminish over time. Therefore, many surfaces will require a second “bumptreatment at the time they are converted to ensure bonding with printing inks, coatings, and ...

  9. Heat therapy - Wikipedia

    en.wikipedia.org/wiki/Heat_therapy

    Heat therapy, also called thermotherapy, is the use of heat in therapy, such as for pain relief and health. It can take the form of a hot cloth, hot water bottle, ultrasound, heating pad, hydrocollator packs, whirlpool baths, cordless FIR heat therapy wraps, and others.