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A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
Many substrates provide a better bonding surface when they are treated at the time they are produced. This is called “pre-treatment.” The effects of corona treatment diminish over time. Therefore, many surfaces will require a second “bump” treatment at the time they are converted to ensure bonding with printing inks, coatings, and ...
Hands-free computing is important because it is useful to both able and disabled users. Speech recognition systems can be trained to recognize specific commands and upon confirmation of correctness instructions can be given to systems without the use of hands. This may be useful while driving or to an inspector or engineer in a factory environment.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Thermal pads can be seen in several locations on this printed circuit board (PCB), in particular, the bottom pad of the three vertical pads in the top left corner. A thermal relief pad, thermal pad or simply thermal, is a printed circuit board (PCB) pad connected to a copper pour using a thermal connection. It looks like a normal pad with ...
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.
Thermal expansion produces mechanical stresses that may cause material fatigue, especially when the thermal expansion coefficients of the materials are different. Humidity and aggressive chemicals can cause corrosion of the packaging materials and leads, potentially breaking them and damaging the inside parts, leading to electrical failure.
Thermal copier Pentacon PENTACOP 110 in a GDR Museum in Dresden. A thermal copier or thermocopier (used as a Tattoo transfer copier) is a kind of photocopi er based on the effect of heat. The original sheet feeds in conjunction with the "thermo-sensitive" paper, generating a copy on its specially treated surface.