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Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.
According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package.
Fan-in WLCSP packages have an interposer that is the same size as that of the die, where as fan-out WLCSP packages have an interposer that is larger than the die, similar to conventional BGA packages, the difference being that the interposer is built directly atop the die, instead of the die being attached to it and reflowed using the flip chip ...
Traditionally the bond pads are located on the edges of the die, however, Flip-chip packaging can be used to place bond pads across the entire surface of the die. Chip scale package (CSP) is another packaging technology. A plastic dual in-line package, like most packages, is many times larger than the actual die hidden inside, whereas CSP chips ...
bonding – any of several technologies that attach one electronic circuit or component to another; see wire bonding, thermocompression bonding, flip chip, hybrid bonding, etc. breadboard – a construction base for prototyping of electronics; bumping – the formation of microbumps on the surface of an electronic circuit in preparation for ...
The direct die feeders are mostly used for flip-chip or chip-on board. Direct die feeder could eliminate separate and dedicated production lines for SMT, bare die, and flip chip by combining them into one. It could also enabling total assembly solutions with much higher speed and flexibility, resulting in lower cost per placement.
Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier. This FPC with the die(s) (TAB inner lead bonding, ILB) can be mounted on the system ...
The underside of a FC-PGA package (The die is on the other side.) A flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array in which the die faces downwards on the top of the substrate with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other cooling mechanism.