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Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]
Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
Ag 44 Cu 27 Zn 13 Cd 15 P 1: Ag–Cu–Zn 595/660 [61] Cd Braze 440. For electrical contacts and copper-tungsten electrodes. Low-melting filler. 27: 13: 44: 15: 1: Cd 95 Ag 5: Cd-Ag 340/395 [61] Cd Braze 053, Braze 53. A high-temperature solder. For medium-strength joints. Can join copper, brass and steel.
Eutectic alloys for soldering, both traditional alloys composed of lead (Pb) and tin (Sn), sometimes with additional silver (Ag) or gold (Au) — especially Sn 63 Pb 37 and Sn 62 Pb 36 Ag 2 alloy formula for electronics - and newer lead-free soldering alloys, in particular ones composed of tin, silver, and copper (Cu) such as Sn 96.5 Ag 3.5.
The two metals are completely miscible as liquids but not as solids; their importance in industry comes from the fact that their properties tend to be suitable over a wide range of variation in silver and copper concentration, although most useful alloys tend to be richer in silver than the eutectic mixture (71.9% silver and 28.1% copper by ...
Indium's high neutron-capture cross-section for thermal neutrons makes it suitable for use in control rods for nuclear reactors, typically in an alloy of 80% silver, 15% indium, and 5% cadmium. [83] In nuclear engineering, the (n,n') reactions of 113 In and 115 In are used to determine magnitudes of neutron fluxes.
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