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  2. J.S.S. Academy of Technical Education, Bengaluru - Wikipedia

    en.wikipedia.org/wiki/J.S.S._Academy_of...

    J.S.S. Academy of Technical Education, Bengaluru (JSSATEB), or in its full name Jagadguru Sri Shivarathreeshwara Academy of Technical Education, Bengaluru, is an engineering college in Bangalore, India established in 1997 and managed by JSS Mahavidyapeetha, Mysore.

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Plastic small-outline no-lead package: QSOP: Quarter-size small-outline package: The terminal pitch is 0.635 mm. [3] SOIC: Small-outline integrated circuit: Also known as SOIC NARROW and SOIC WIDE: SOJ: Small-outline J-leaded package SON Small-outline no-lead package SSOP: Shrink small-outline package [3] TSOP: Thin small-outline package [3] TSSOP

  4. Acharya Institutes - Wikipedia

    en.wikipedia.org/wiki/Acharya_institutes

    Acharya Institutes [7] is a group of educational institutions located in Bangalore, India. The institutes were established in 1990 and offer a range of undergraduate and postgraduate programs in various fields.

  5. JSSATE - Wikipedia

    en.wikipedia.org/?title=JSSATE&redirect=no

    What links here; Related changes; Upload file; Permanent link; Page information; Cite this page; Get shortened URL; Download QR code

  6. Thin small outline package - Wikipedia

    en.wikipedia.org/wiki/Thin_small_outline_package

    Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).

  7. JSS Academy of Technical Education - Wikipedia

    en.wikipedia.org/wiki/JSS_Academy_of_Technical...

    JSS Academy of Technical Education may refer to: ... Bangalore; J.S.S. Academy of Technical Education, Noida This page was last edited on ...

  8. Wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Wafer-level_packaging

    WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.

  9. Thin shrink small outline package - Wikipedia

    en.wikipedia.org/wiki/Thin_Shrink_Small_Outline...

    The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm.