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  2. Flip chip - Wikipedia

    en.wikipedia.org/wiki/Flip_chip

    In 2008, High-speed mounting methods evolved through a cooperation between Reel Service Ltd. and Siemens AG in the development of a high speed mounting tape known as 'MicroTape'. By adding a tape-and-reel process into the assembly methodology , placement at high speed is possible, achieving a 99.90% pick rate and a placement rate of 21,000 cph ...

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Although surface-mount, these devices require specific process for assembly. Chip-on-board (COB), a bare silicon chip, that is usually an integrated circuit, is supplied without a package (which is usually a lead frame overmolded with epoxy) and is attached, often with epoxy, directly to a circuit board.

  4. Dicing tape - Wikipedia

    en.wikipedia.org/wiki/Dicing_tape

    Dicing tape can be made of PVC, polyolefin, or polyethylene backing material with an adhesive to hold the wafer or substrate in place. In some cases dicing tape will have a release liner that will be removed prior to mounting the tape to the backside of the wafers, with a variety of adhesive strengths, designed for various wafer/substrate sizes and materials.

  5. Hurricane hacks that are myths: Tape can’t protect your ...

    www.aol.com/hurricane-hacks-myths-tape-t...

    For premium support please call: 800-290-4726 more ways to reach us

  6. Pick-and-place machine - Wikipedia

    en.wikipedia.org/wiki/Pick-and-place_machine

    Surface mount components are placed along the front (and often back) faces of the machine. Most components are supplied on paper or plastic tape, in tape reels that are loaded onto feeders mounted to the machine. Larger integrated circuits (ICs) are sometimes supplied and arranged in trays which are stacked in a compartment. More commonly used ...

  7. Thick-film technology - Wikipedia

    en.wikipedia.org/wiki/Thick-film_technology

    Thick-film technology is used to produce electronic devices/modules such as surface mount devices modules, hybrid integrated circuits, heating elements, integrated passive devices and sensors. The main manufacturing technique is screen printing ( stenciling ), which in addition to use in manufacturing electronic devices can also be used for ...

  8. Gaffer tape - Wikipedia

    en.wikipedia.org/wiki/Gaffer_tape

    Gaffer tape (also known as gaffer's tape, gaff tape or gaffa tape [1] as well as spike tape for narrow, colored gaffer tape) is a heavy cotton cloth pressure-sensitive tape with strong adhesive and tensile properties. It is widely used in theatre, photography, film, radio and television production, and industrial staging work.

  9. Miami Dolphins can't tackle, execute, aren't physical in The ...

    www.aol.com/miami-dolphins-cant-tackle-execute...

    The Tape Don't Lie: Miami Dolphins don't execute, don't tackle, don't get tough enough in Thanksgiving loss at Green Bay.

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