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Injection molding of liquid silicone rubber (LSR) is a process to produce pliable, durable parts in high volume.. Liquid silicone rubber is a high purity platinum cured silicone with low compression set, good stability and ability to resist extreme temperatures of heat and cold ideally suitable for production of parts, where high quality is required.
In its uncured state, silicone rubber is a highly adhesive gel or liquid. To convert it to a solid, it must be cured, vulcanized, or catalyzed.This is normally carried out in a two-stage process at the point of manufacture into the desired shape, and then in a prolonged post-cure process.
Silicones also exhibit good chemical resistance and high-temperature resistance (205 °C, 400 °F and higher). For this reason, silicone molds are suitable for casting low-melt metals and alloys (e.g. zinc, tin, pewter, and Wood's metal). RTV silicone rubbers are, however, generally expensive – especially platinum-cure.
Copper flange gaskets used for ultra-high vacuum systems. A flange gasket is a type of gasket made to fit between two sections of pipe that are flared to provide higher surface area. Flange gaskets come in a variety of sizes and are categorized by their inside diameter and their outside diameter. There are many standards in gasket for flanges ...
Silastic-brand silicone elastomers have a range of applications. In the automotive industry they are used for making gaskets, spark plug boots, hoses and other components that must operate over a broad temperature range and resist oil and coolants.
The flange design, inner and outer conductor dimensions are standardized, by EIA, in the RS-225, 50 Ω (ohm), and RS-259, 75 Ω, standards.They are commonly referred to by the inner diameter of the outer conductor in fractional inches.
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
Different manufacturers use different names for this package: ML (micro-leadframe) versus FN (flat no-lead), in addition there are versions with pads on all four sides (quad) and pads on just two sides (dual), thickness varying between 0.9–1.0 mm for normal packages and 0.4 mm for extremely thin. Abbreviations include:
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