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Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
A PCB milling machine (referred to as a 'PCB Prototyper') operates in a similar way to a plotter, receiving commands from the host software that control the position of the milling head in the x, y, and (if relevant) z axis. Laser resist ablation involves spraying black paint onto copper clad laminate, then placing the board into CNC laser ...
The thickness of gold plating on jewellery is noted in microns (or micro-meters). The microns of thickness determines how long the gold plating lasts with usage. The jewellery industry denotes different qualities of gold plating in the following terminology Gold flashed / Gold washed - gold layer thickness less than 0.5 micron
Electroless nickel plating, covered by a thin layer of gold, is used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improving the solderability of copper contacts and plated through holes and vias. The gold is typically applied by quick immersion in a solution containing gold salts.
Through-hole devices mounted on the circuit board of a mid-1980s home computer.Axial-lead devices are at upper left, while blue radial-lead capacitors are at upper right Close-up view of an electronic circuit board showing component lead holes (gold-plated) with through-hole plating up the sides of the hole to connect tracks on both sides of the board.
An updated flash flood warning was issued by the NWS Fort Worth TX on Wednesday at 2:37 p.m. "At 2:37 p.m., Emergency management reported multiple flooded roadways due to thunderstorms producing ...
Flash flooding, some turning life-threatening, occurred around Dallas, including interstate 35 and farther to the east in northern Texas, to the north in Beware Dallas: Dangerous, disruptive flash ...
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]