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Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
The thickness of gold plating on jewellery is noted in microns (or micro-meters). The microns of thickness determines how long the gold plating lasts with usage. The jewellery industry denotes different qualities of gold plating in the following terminology Gold flashed / Gold washed - gold layer thickness less than 0.5 micron
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Electroplating baths and equipment based on the patents of the Elkingtons were scaled up to accommodate the plating of numerous large-scale objects and for specific manufacturing and engineering applications. The plating industry received a big boost with the advent of the development of electric generators in the late 19th
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The product became available in the United States, Canada, and Mexico beginning in 1986, marketed by San Diego–based ACCEL Technologies, Inc., under the name Tango PCB. [3] In 1987, Protel launched the circuit diagram editor Protel Schematic for DOS.