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  2. Conductive anodic filament - Wikipedia

    en.wikipedia.org/wiki/Conductive_anodic_filament

    There are several design considerations and mitigation techniques that can be used to reduce the susceptibility to CAF. Certain material selection (i.e. laminate) and design rules (i.e. via spacing) can help reduce CAF risk. Poor adhesion between the resin and glass fibers in the PCB can create a path for CAF to occur.

  3. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.

  4. Conformal coating - Wikipedia

    en.wikipedia.org/wiki/Conformal_coating

    Conformal coating is a protective, breathable coating of thin polymeric film applied to printed circuit boards (PCBs). Conformal coatings are typically applied with 25–250 μm [ 1 ] thickness on electronic circuitry to protect against moisture and other substances. Coatings can be applied in many ways, including brushing, spraying, dispensing ...

  5. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    When a PCB has no components installed, it is less ambiguously called a printed wiring board (PWB) or etched wiring board. [19] However, the term "printed wiring board" has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). In informal ...

  6. Material selection - Wikipedia

    en.wikipedia.org/wiki/Material_selection

    Material selection. Material selection is a step in the process of designing any physical object. In the context of product design, the main goal of material selection is to minimize cost while meeting product performance goals. [1] Systematic selection of the best material for a given application begins with properties and costs of candidate ...

  7. Flexible electronics - Wikipedia

    en.wikipedia.org/wiki/Flexible_electronics

    Flexible electronics, also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester [1] film. Additionally, flex circuits can be screen printed silver circuits on polyester.

  8. Solder mask - Wikipedia

    en.wikipedia.org/wiki/Solder_mask

    Solder mask, solder stop mask or solder resist is a thin lacquer -like layer of polymer that is usually applied to the copper traces of a printed circuit board (PCB) for protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads. Soldermask [2] is a printed circuit board (PCB) manufacturing ...

  9. Power electronic substrate - Wikipedia

    en.wikipedia.org/wiki/Power_electronic_substrate

    Power electronic substrate. The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage ...

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