Search results
Results from the WOW.Com Content Network
Help; Learn to edit; Community portal; Recent changes; Upload file; Special pages
youtube-dl -F <url> The video can be downloaded by selecting the format code from the list or typing the format manually: youtube-dl -f <format/code> <url> The best quality video can be downloaded with the -f best option. Also, the quality of the audio and video streams can be specified separately and merged with the + operator. [35]
Specifically, to count as a legitimate view, a user must intentionally initiate the playback of the video and play at least 30 seconds of the video (or the entire video for shorter videos). Additionally, while replays count as views, there is a limit of 4 or 5 views per IP address during a 24-hour period, after which point, no further views ...
BGA ICs assembled on a Memory module. The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed.
Thick-film circuits/modules are widely used in the automotive industry, both in sensors, e.g. mixture of fuel/air, pressure sensors, engine and gearbox controls, sensor for releasing airbags, ignitors to airbags; common is that high reliability is required, often extended temperature range also along massive thermocycling of circuits without ...
Selective soldering machine. Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes.
The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. [2] A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. [3] Ball grid array, chip-scale package, and flip chip packages generally use solder balls.
Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...