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Surface-mount technology was developed in the 1960s. By 1986, surface-mounted components accounted for 10% of the market at most but were rapidly gaining popularity. [4] By the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices.
Variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead. TAB: Tape-automated bonding: Variation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires. Used by LCD driver ICs. COG: Chip-on-glass
The Double Decawatt Package, [1] [2] D2PAK, SOT404 or DDPAK, standardized as TO-263, [3] is a semiconductor package type intended for surface mounting on circuit boards.The TO-263 is designed by Motorola.
Metal electrode leadless face (MELF) is a type of leadless cylindrical electronic surface mount device that is metallized at its ends. MELF devices are usually diodes and resistors. [1] The EN 140401-803 and JEDEC DO-213 standards describe multiple MELF components. [2]
TO-252, also known as DPAK [1] or Decawatt Package, is a semiconductor package developed by Motorola [2] for surface mounting on circuit boards. [3] It represents a surface-mount [4] variant of TO-251 package, and smaller variant of the D2PAK package. It is often used for high-power MOSFETs and voltage regulators.
LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
Looking out the window from his office in Boulder, Sanders said he wanted to establish a legacy that would merit chiseling his face into the mountains there like the presidents at Mount Rushmore.
Flatpack is a US military standardized printed-circuit-board surface-mount-component package. The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two opposing sides of the package periphery.
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