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A small transformer potted in epoxy. The surface visible on the right is formed by the potting compound that has been poured into the plastic box. In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound.
Epoxy is the family of basic components or cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called epoxy. [1] The IUPAC name for an epoxide group is an oxirane.
Primers for heat-shrinkable sleeves work in the same manner as an FBE primer does when it is specified on 3-layer polyolefin pipeline coatings and is typically applied between 150 μm and 300 μm thick. Usually, the primer of heat shrinkable sleeve is two components non-solvent Epoxy, one is primer base and the other is curing agent.
Glass fibre is the fibre most frequently used for filament winding, carbon and aramid fibres are also used. Most high strength critical aerospace structures are produced with epoxy or polyurethane resins, with either epoxy, polyurethane or cheaper polyester resins being specified for most other applications.
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Today, epoxy and the acrylic types predominate. The description and the generally touted advantages are as follows: Epoxy: Although aliphatic epoxy materials have been used, the majority of EPD epoxy types are based on aromatic epoxy polymers, most commonly based on polymerization of diglycidal ethers of bis phenol A. The polymer backbone may ...
The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3] The intermediate layer is applied by spin-on, spray-on, screen-printing, embossing, dispensing or block printing on one or two substrate surfaces.