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Fatigue life scatter tends to increase for longer fatigue lives. Damage is irreversible. Materials do not recover when rested. Fatigue life is influenced by a variety of factors, such as temperature, surface finish, metallurgical microstructure, presence of oxidizing or inert chemicals, residual stresses, scuffing contact , etc.
Vibration fatigue is a mechanical engineering term describing material fatigue, caused by forced vibration of random nature. An excited structure responds according to its natural-dynamics modes, which results in a dynamic stress load in the material points. [ 1 ]
Low cycle fatigue (LCF) has two fundamental characteristics: plastic deformation in each cycle; and low cycle phenomenon, in which the materials have finite endurance for this type of load. The term cycle refers to repeated applications of stress that lead to eventual fatigue and failure; low-cycle pertains to a long period between applications.
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Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress of solder as a result of repeated temperature fluctuations, mechanical vibrations, or mechanical loads.
When cyclic stresses are applied to a material, even though the stresses do not cause plastic deformation, the material may fail due to fatigue. Fatigue failure is typically modeled by decomposing cyclic stresses into mean and alternating components. Mean stress is the time average of the principal stress.
The tool path and normal pressure applied are designed to create a distribution of compressive residual stress. The form of the distribution is designed to counter applied stresses and optimize fatigue and stress corrosion performance. Since there is no shear being applied to the ball, it is free to roll in any direction.
Fatigue alone is the driving cause of failure in this case, causing the material to fail before oxidation can have much of an effect. [1] TMF still is not fully understood. There are many different models to attempt to predict the behavior and life of materials undergoing TMF loading. The two models presented below take different approaches.