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A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Space Shuttle Discovery as it approaches the International Space Station during the STS-114 on 28 July 2005. The Space Shuttle thermal protection system (TPS) is the barrier that protected the Space Shuttle Orbiter during the searing 1,650 °C (3,000 °F) heat of atmospheric reentry.
Thermal insulation. Thermal insulation is the reduction of heat transfer (i.e., the transfer of thermal energy between objects of differing temperature) between objects in thermal contact or in range of radiative influence. Thermal insulation can be achieved with specially engineered methods or processes, as well as with suitable object shapes ...
Thermal paste is designed to fill imperfections on the surface of a chip. Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is ...
Refractory metals. Refractory metals are a class of metals that are extraordinarily resistant to heat and wear. The expression is mostly used in the context of materials science, metallurgy and engineering. The definition of which elements belong to this group differs. The most common definition includes five elements: two of the fifth period ...
Industrial Insulation. Rigid polyurethane foam is used in various industries to provide thermal insulation to installations and pipes. In particular, the piping for district heating systems in Europe is primarily insulated using a pre-insulated pipes sandwich assembly composed of a steel heat service pipe, an insulating layer (polyurethane foam) and a polyethylene (PE) casing, which are bonded ...
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