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2. Thermal paste - Wikipedia

   en.wikipedia.org/wiki/Thermal_paste

   When a CPU heat spreader is coupled to the die via thermal paste, performance enthusiasts such as overclockers are able to, in a process known as "delidding", [3] pry the heat spreader, or CPU "lid", from the die. This allows them to replace the thermal paste, which is usually of low-quality, with a thermal paste having greater thermal ...

3. Thermally conductive pad - Wikipedia

   en.wikipedia.org/wiki/Thermally_conductive_pad

   In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).

4. Computer cooling - Wikipedia

   en.wikipedia.org/wiki/Computer_cooling

   Thermal compound is commonly used to enhance the thermal conductivity from the CPU, GPU, or any heat-producing components to the heatsink cooler. (Counterclockwise from top left: Arctic MX-2, Arctic MX-4, Tuniq TX-4, Antec Formula 7, Noctua NT-H1).

5. Freezer (computer cooling) - Wikipedia

   en.wikipedia.org/wiki/Freezer_(computer_cooling)

   The Freezer is the name of the CPU coolers from Arctic GmbH, which has been the company's staple product for many years. [1] To most enthusiasts, Arctic is best known for their Freezer line of CPU coolers as well as their thermal compound called MX-2 and MX-4. [2]

6. Thermal interface material - Wikipedia

   en.wikipedia.org/wiki/Thermal_interface_material

   A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

7. Heat sink - Wikipedia

   en.wikipedia.org/wiki/Heat_sink

   Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of a material with a high thermal conductivity , such as aluminium or copper.

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9. Thermal design power - Wikipedia

   en.wikipedia.org/wiki/Thermal_design_power

   Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).