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Here are the top five bathroom tile trends that interior designers expect to see everywhere in the new year. ... Related: 20 Bathroom Floor Tile Ideas That Go Beyond the Basics.
Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [3] To clean and protect the part during the plating process, a combination of heat treating, cleaning, masking, pickling, and etching may be used. [1]
Immersion zinc plating is an electroless (non-electrolytic) coating process that deposits a thin layer of zinc on a less electronegative metal, by immersion in a solution containing a zinc or zincate ions, Zn(OH) 2− 4. A typical use is plating aluminum with zinc prior to electrolytic or electroless nickel plating.
It is filled with a sample of the plating solution and an appropriate anode which is connected to a rectifier. The "work" is replaced with a Hull cell test panel that will be plated to show the "health" of the bath. The Hull cell is a trapezoidal container that holds 267 milliliters of a plating bath solution.
A sulfate-based bath that uses insoluble catalytic anodes, which maintains an electrode potential that prevents oxidation. The trivalent chromium-plating process can plate the workpieces at a similar temperature, rate and hardness, as compared to hexavalent chromium. Plating thickness ranges from 5 to 50 μin (0.13 to 1.27 μm). [2]
Mechanical plating, also known as peen plating, mechanical deposition, or impact plating, is a plating process that imparts the coating by cold welding fine metal particles to a workpiece. Mechanical galvanization is the same process, but applies to coatings that are thicker than 0.001 in (0.025 mm). [ 1 ]
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
The plating bath also often includes: complexing agents , such as carboxylic acids or amines to increase phosphate solubility and to prevent the white-out phenomena by slowing the reaction. stabilizers, such as lead salts, sulfur compounds, or various organic compounds, to slow the reduction by co-depositing with the nickel.
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