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Most of this energy is subsequently released as heat to the surrounding equipment space. Since most of the remaining central office energy use goes to cool the equipment room, the economic impact of making the electronic equipment energy-efficient would be considerable for companies that use and operate telecommunications equipment.
Heat conducted through the MCPCB and heat sink is dissipated by convection and radiation. In the package design, the surface flatness and quality of each component, applied mounting pressure , contact area, the type of interface material and its thickness are all important parameters to thermal resistance design.
Some food processing equipment may make use of Joule heating: running a current through food material (which behave as an electrical resistor) causes heat release inside the food. [2] The alternating electrical current coupled with the resistance of the food causes the generation of heat. [3] A higher resistance increases the heat generated.
Sources of waste heat include all manner of human activities, natural systems, and all organisms, for example, incandescent light bulbs get hot, a refrigerator warms the room air, a building gets hot during peak hours, an internal combustion engine generates high-temperature exhaust gases, and electronic components get warm when in operation.
Processor power dissipation or processing unit power dissipation is the process in which computer processors consume electrical energy, and dissipate this energy in the form of heat due to the resistance in the electronic circuits.
Hence, once we know the thermal power to be dissipated (Pd), the maximum allowed case temperature (Tc) of the CPU and the maximum expected ambient temperature (Ta) of the air entering the cooling fans, we can determine the fundamental characteristics of the required Heat sink, i.e. its thermal resistance Rca, as:
Limiting heat-producing appliances, Checking weather stripping on doors and windows; Installing ceiling fans to help circulate air, though don’t use this as a sole cooling device.
The thermal resistance of materials is of great interest to electronic engineers because most electrical components generate heat and need to be cooled. Electronic components malfunction or fail if they overheat, and some parts routinely need measures taken in the design stage to prevent this.