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A heat sink usually consists of a metal structure with one or more flat surfaces to ensure good thermal contact with the components to be cooled, and an array of comb or fin like protrusions to increase the surface contact with the air, and thus the rate of heat dissipation. A heat sink is sometimes used in conjunction with a fan to increase ...
The heat dissipation in integrated circuits problem has gained an increasing interest in recent years due to the miniaturization of semiconductor devices. The temperature increase becomes relevant for cases of relatively small-cross-sections wires, because such temperature increase may affect the normal behavior of semiconductor devices.
Such increase in temperature can affect the behavior of surrounding semiconductor devices. Important parameters like mobility change drastically. That is why the heat dissipation is a relevant issue and must be considered for circuit designing.
Cooling system of an Asus GTX 650 graphics card; three heat pipes are visible. Heat dissipation is an unavoidable by-product of electronic devices and circuits. [10] In general, the temperature of the device or component will depend on the thermal resistance from the component to the environment, and the heat dissipated by the component.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
It is essential to optimize the building insulation, evaluate the efficiency of electronic devices, and enhance the performance of heat sinks in various applications. Objects made of insulators like rubber tend to have very high resistance and low conductance, while objects made of conductors like metals tend to have very low resistance and ...
Heat dissipation of 3000 W/cm 2 has been reported with this technique. [45] The heat dissipation can be further increased if two-phase flow cooling is applied. Unfortunately, the system requires large pressure drops, due to the small channels, and the heat flux is lower with dielectric coolants used in electronic cooling.
A thermoelectric cooler is a solid-state electronic device that pumps (transfers) heat from one side of the device to the other when an electric current is passed through it. It is based on the Peltier effect. A thermal diode or thermal rectifier is a device that causes heat to flow preferentially in one direction.